Teledyne e2v’s semiconductor manufacturing site in Grenoble, France, has received the globally recognized aerospace MIL-PRF-38535 Class Y certification, awarded by the Defense Logistics Agency (DLA).
GRENOBLE, FRANCE – Media OutReach – 25 th June 2018 – Teledyne e2v is the first semiconductor manufacturer in Europe, and only third in the world, to be awarded the site level MIL-PRF-38535 Class Y certification from the DLA. Also known as QML Class Y, the certification is recognized as the highest guarantee of quality and reliability for ceramic, non-hermetically sealed Flip-Chip microcircuits for aerospace and defense (A&D) applications. In addition to QML Class Y, Teledyne e2v has also been awarded QML Class V for its ceramic, hermetically sealed Flip-Chip microcircuits.
Teledyne e2v worked closely with the DLA and NASA to help shape the QML
Class Y certification and now holds AS9100 and QML Classes Q, V and Y site
certifications, making it one of the highest qualified manufacturers of
advanced semiconductor solutions in the world.
Teledyne e2v is already certified to QML Classes Q and V for wire bonded
devices; however the new certifications received from the DLA allows Teledyne
e2v to guarantee solutions developed to serve the growing demand to use Flip-Chip
packages in A&D applications. Noted as a landmark event in its long-term
strategy to deliver the highest quality devices possible for its customers, the
site level certification plays a vital role in its plans to qualify its latest
space grade solutions to QML Class Y.
Laurent Monge, President of Semiconductors and General Manager of
Teledyne e2v’s Grenoble site, commented, “Being awarded QML Class Y is a huge
reward for the efforts and investment made by the entire team at our Grenoble
site. It is a symbol of the standards we judge ourselves against when
developing and packaging world leading digital and signal processing solutions.”
The QML Class Y certification arrives as Teledyne e2v announces the
availability of its Industrialization and Manufacturing Services, offering
world leading capabilities in semiconductor packaging solutions. Evelyne Tur,
Vice President of Operations and Manufacturing Services at Teledyne e2v, added,
“The addition of QML certification for non-hermetically sealed solutions means
we can now serve customers requiring any type of semiconductor space package,
including Flip-Chip, Wire Bond, Ceramic and Plastic, hermetically or
For more information, visit e2v.com/IMS.
Notes to Editors:
About Teledyne e2v
Teledyne e2v’s innovations lead developments in healthcare, life sciences, space, transportation, defence and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully-custom solutions, bringing increased value to their systems.